Methods of manufacture of polyetherimides

ABSTRACT

A method of manufacture of a polyetherimide composition includes contacting a substituted phthalic anhydride and an organic diamine in the presence of diphenyl sulfone, sulfolane, or a combination comprising at least one of the foregoing solvents at a temperature of greater than 130° C. to provide a bis(phthalimide) composition comprising diphenyl sulfone, sulfolane, or a combination comprising at least one of the foregoing solvents and a bis(phthalimide); and polymerizing the bis(phthalimide) and an alkali metal salt of a dihydroxy aromatic compound in the presence of diphenyl sulfone, sulfolane, or a combination comprising at least one of the foregoing to form a polyetherimide. The method does not require any catalyst either for the imidization or the polymerization.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. application Ser. No. 15/980,180,filed May 15, 2018, which is a division of U.S. application Ser. No.15/304,102, filed Oct. 14, 2016, which is a National Stage applicationof PCT/US2015/025948, filed Apr. 15, 2015, which claims the benefit ofU.S. Provisional Application No. 61/979,713, filed Apr. 15, 2014, thecontents of all of which are incorporated herein by reference in theirentirety.

BACKGROUND

This disclosure relates to methods of manufacture of polyetherimidecompositions.

Polyetherimides (“PEIs”) are amorphous, transparent, high performancepolymers having a glass transition temperature (“Tg”) of greater than180° C. PEIs further have high strength, heat resistance, modulus, andbroad chemical resistance, and therefore are widely used in applicationsas diverse as automotive, telecommunication, aerospace,electrical/electronics, transportation, and healthcare. One process forthe manufacture of polyetherimides is by polymerization of alkali metalsalts of dihydroxyaromatic compounds, such as bisphenol A disodium salt(“BPANa₂”), with a substituted bis(phthalimide) such as abis(halophthalimide). For example, polyetherimides can be produced bypolymerization of BPANa₂ with 1,3-bis[N-(4-chlorophthalimido)]benzene(“4-ClPAMI”), which has the following structure.

Other isomers of the ClPAMI can also be present. Substitutedbis(phthalimides) such as bis(halophthalimide)s, in turn, can beproduced by imidization of a substituted or halophthalic anhydride suchas 3-chlorophthalic anhydride (“3-ClPA”), 4-chlorophthalic anhydride(“4-ClPA”), or mixtures thereof with an organic diamine such asm-phenylenediamine (“mPD”) or p-phenylenediamine (“pPD”).

The polymerization is typically carried out between a dialkali salt of abisphenol with a bis(halophthalimide) in an aromatic solvent in thepresence of a polymerization catalyst. Attempts have been made toproduce polyetherimides without using any catalyst to lower themanufacturing costs of the polymer. However, such processes require thepurification and isolation of the substituted intermediatebis(phthalimide), which is cumbersome and not desirable in a commercialsetting.

Thus there remains a need in the art for an improved process for themanufacture of polyetherimides that does not require a polymerizationcatalyst. It would be a further advantage if a substitutedbis(phthalimide) can be made and used directly in the displacementpolymerization without isolation and purification.

SUMMARY

A method for the manufacture of a polyetherimide composition comprises:contacting a substituted phthalic anhydride and an organic diamine inthe presence of diphenyl sulfone or sulfolane or a combinationcomprising at least one of the foregoing solvents at a temperature ofgreater than 130° C., wherein the substituted phthalic anhydride has aformula

and the organic diamine has a formula H₂N—R—NH₂, to provide abis(phthalimide) composition comprising diphenyl sulfone or sulfolane ora combination comprising at least one of the foregoing solvents and abis(phthalimide) of the formula

and polymerizing the bis(phthalimide) and an alkali metal salt of adihydroxy aromatic compound of the formula MO—Z—OM in the presence ofdiphenyl sulfone, sulfolane, a combination comprising at least one ofthe foregoing solvents to form a polyetherimide of the formula

wherein in the foregoing formulae X is fluoro, chloro, bromo, iodo,nitro, or a combination comprising at least one of the foregoing; R isan aromatic hydrocarbon group having 6 to 27 carbon atoms, a halogenatedderivative thereof, a straight or branched chain alkylene group having 2to 10 carbon atoms, a halogenated derivative thereof, a cycloalkylenegroup having 3 to 20 carbon atoms, a halogenated derivative thereof,—(C₆H₁₀)_(z)— wherein z is an integer from 1 to 4, an aromatichydrocarbyl moiety having from 1 to 6 aromatic groups, and a divalentgroup of the formula

wherein Q¹ is —O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y isan integer from 1 to 5, or a combination comprising at least one of theforegoing; M is an alkali metal; Z is an aromatic C₆₋₂₄ monocyclic orpolycyclic moiety optionally substituted with 1 to 6 C₁₋₈ alkyl groups,1 to 8 halogen atoms, or a combination comprising at least one of theforegoing; and n is an integer greater than 1.

In another embodiment, a method for the manufacture of a polyetherimidecomposition comprises: contacting a substituted phthalic anhydride andan organic diamine in the presence of diphenyl sulfone, sulfolane, or acombination comprising at least one of the foregoing solvents at atemperature of 130° C. to 250° C., wherein the substituted phthalicanhydride has a formula

and the organic diamine has a formula H₂N—R—NH₂, to provide abis(phthalimide) composition comprising diphenyl sulfone, sulfolane, ora combination comprising at least one of the foregoing solvents and abis(phthalimide) of the formula

and polymerizing the bis(phthalimide) and a disodium salt or adipotassium salt of bisphenol A in the presence of diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoingsolvents to form a polyetherimide of the formula

wherein in the foregoing formulae X is chloro; R is m-phenylene,p-phenylene, p,p-diphenylether, or 4,4′-diphenylsulfone; Z is

and n is an integer greater than 1.

Also disclosed is a polyetherimide composition manufactured by themethods of the disclosure

Still further disclosed is a polyetherimide composition wherein thepolyetherimide has a structure of the formula

wherein R is an aromatic hydrocarbon group having 6 to 27 carbon atoms,a halogenated derivative thereof, a straight or branched chain alkylenegroup having 2 to 10 carbon atoms, a halogenated derivative thereof, acycloalkylene group having 3 to 20 carbon atoms, a halogenatedderivative thereof, —(C₆H₁₀)_(z)— wherein z is an integer from 1 to 4,an aromatic hydrocarbyl moiety having from 1 to 6 aromatic groups, and adivalent group of the formula

wherein Q¹ is —O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y isan integer from 1 to 5, or a combination comprising at least one of theforegoing; and Z is an aromatic C₆₋₂₄ monocyclic or polycyclic moietyoptionally substituted with 1 to 6 C₁₋₈ alkyl groups, 1 to 8 halogenatoms, or a combination comprising at least one of the foregoing; and nis an integer greater than 1; wherein the composition comprises one ormore of greater than 0.1 parts per million of diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoing, orgreater than 1 part per million of sodium or potassium, or a yellownessindex of less than 300.

BRIEF DESCRIPTION OF THE DRAWINGS

A description of the figures, which are meant to be exemplary and notlimiting, is provided in which:

FIG. 1 is a graph of Mw of polyetherimide as a function ofpolymerization time; and

FIG. 2 is a graph of Mw of polyetherimide as a function ofpolymerization time with different bisphenol A salt and ClPAMI molarratio.

DETAILED DESCRIPTION

The inventor hereof has surprisingly found that it is now possible tomake substituted bis(phthalimide)s in polar aprotic solvents having ahigh boiling point, for example, diphenyl sulfone, or tetramethylenesulfone without using any imidization catalyst. The prepared substitutedbis(phthalimide)s in polar aprotic solvents can be used directly indisplacement polymerization without separating it from the polar aproticsolvents. In an advantageous feature, no polymerization catalyst isrequired for the polymerization.

Polyetherimides produced by the methods disclosed herein are of formula(1)

wherein n is greater than 1, for example 10 to 1,000, specifically 10 to500, or 10 to 100, preferably 10 to 50.

The group R in formula (1) is a C₆₋₂₇ aromatic hydrocarbon group or ahalogenated derivative thereof, a straight or branched chain C₂₋₂₀,specifically C₂₋₁₀ alkylene group or a halogenated derivative thereof, aC₃₋₂₀ cycloalkylene group or halogenated derivative thereof,—(C₆H₁₀)_(z)— wherein z is an integer from 1 to 4, an aromatichydrocarbyl moiety having from 1 to 6 aromatic groups, and a group offormula (2)

wherein Q¹ is —O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y isan integer from 1 to 5, or a combination comprising at least one of theforegoing.

In an embodiment R is —(C₆H₁₀)_(z)— wherein z is an integer from 1 to 4or a divalent group of formulae (3)

wherein Q¹ is —O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y isan integer from 1 to 5, or a combination comprising at least one of theforegoing. In some embodiments, R is the diether aromatic moiety offormula (3) having four phenylene groups wherein Q¹ is a direct bond,—O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y is an integerfrom 1 to 5. In some embodiments R is m-phenylene, p-phenylene, or adiaryl ether such as p,p-diphenylether, or a diarylsulfone such as4,4′-diphenylsulfone. Embodiments where R is a divalent arylene ethercan also be specifically mentioned, for example an arylene ether of theformula

wherein Q¹ is a direct bond, —O—, —S—, —C(O)—, —SO₂—, —SO—,—C_(y)H_(2y)— wherein y is an integer from 1 to 5, or a combinationcomprising at least one of the foregoing. In an embodiment, Q¹ informula (3a) is —O—.

The group Z in formula (1) is a substituted or unsubstituted divalentorganic group, and can be an aromatic C₆₋₂₄ monocyclic or polycyclicmoiety optionally substituted with 1 to 6 C₁₋₈ alkyl groups, 1 to 8halogen atoms, or a combination thereof, provided that the valence of Zis not exceeded. Exemplary groups Z include groups of formula (4):

wherein R^(a) and R^(b) are each independently a halogen atom or amonovalent hydrocarbon group and can be the same or different; p and qare each independently integers of 0 to 4; c is 0 to 4, specificallyzero or 1; and X^(a) is a bridging group connecting the two aromaticgroups, where the bridging group and point of attachment of each C₆arylene group are disposed ortho, meta, or para (specifically para) toeach other on the C₆ arylene group. The bridging group X^(a) can be asingle bond, —O—, —S—, —S(O)—, —S(O)₂—, —C(O)—, or a C₁₋₁₈ organicbridging group. The C₁₋₁₈ organic bridging group can be cyclic oracyclic, aromatic or non-aromatic, and can further comprise heteroatomssuch as halogens, oxygen, nitrogen, sulfur, silicon, or phosphorous. TheC₁₋₁₈ organic group can be disposed such that the C₆ arylene groupsconnected thereto are each connected to a common alkylidene carbon or todifferent carbons of the C₁₋₁₈ organic bridging group. A specificexample of a group Z is a divalent group of formula (4a)

wherein Q² is a single bond, —O—, —S—, —C(O)—, —SO₂—, —SO—,—C_(y)H_(2y)— and a halogenated derivative thereof wherein y is aninteger from 1 to 5, including perfluoroalkylene groups. In a specificembodiment Q² is 2,2-isopropylidene, such that is Z is of formula (4b).

In another specific embodiment Q² is a single bond.

In another specific embodiment, the polyetherimide comprises more than1, specifically 10 to 100, 10 to 80, or 10 to 50 structural units, offormula (1) wherein R is a divalent group of formula (2) wherein Q¹ is—C_(y)H_(2y)— wherein y is an integer from 1 to 5, and Z is a group offormula (4a) wherein Q² is —O—, —S—, —C(O)—, —SO₂—, —SO—, or—C_(y)H_(2y)— or a halogenated derivative thereof wherein y is aninteger from 1 to 5. In some embodiments, R is m-phenylene, p-phenylene,p,p-diphenylether, 4,4′-diphenylsulfone, or a combination comprising atleast one of the foregoing, and Z is 2,2-(4-phenylene)isopropylidene. Insome embodiments, the polyetherimide is a polyetherimide sulfone. Aspecific polyetherimide sulfone comprises structural units of formula(1) wherein at least 50 mole percent of the R groups are of formula (4a)wherein Q² is —SO₂— and the remaining R groups are independentlyp-phenylene or m-phenylene or a combination comprising at least one ofthe foregoing; and Z is 2,2-(4-phenylene)isopropylidene.

The polyetherimides are prepared first by imidization of a substitutedphthalic anhydride with an organic diamine to form a bis(phthalimide),followed by polymerization of the bis(phthalimide) at the substitutedposition. In this method, a substituted phthalic anhydride of formula(7)

wherein X is a leaving group (such as a nitro group or a halogen), iscondensed (imidized) with an organic diamine of formula (8)

H₂N—R—NH₂  (8)

wherein R is as described in formula (1), in the presence of diphenylsulfone at a temperature of greater than 130° C. to form a compositioncomprising bis(phthalimide) of formula (9) and diphenyl sulfone

wherein X is a leaving group as in formula (7) and R is a linker asdescribed in formula (1).

In an embodiment, X is a nitro group or a halogen, specifically fluoro,chloro, bromo, iodo, more specifically chloro. A mixture of different Xgroups can be used.

Illustrative examples of amine compounds of formula (8) are described inU.S. Pat. Nos. 3,875,116; 6,919,422 and 6,355,723 for example.Combinations comprising any of the foregoing amines can be used.Specifically, diamine (8) is a meta-phenylene diamine (8a), apara-phenylene diamine (8b), or a diamino diaryl sulfone (8c), or anarylene ether (8d)

wherein R^(a) and R^(b) are each independently a halogen atom, nitro,cyano, C₂-C₂₀ aliphatic group, C₂-C₄₀ aromatic group, and a and b areeach independently 0 to 4. Specific examples includemeta-phenylenediamine (mPD), para-phenylenediamine (pPD),2,4-diaminotoluene, 2,6-diaminotoluene,2-methyl-4,6-diethyl-1,3-phenylenediamine,5-methyl-4,6-diethyl-1,3-phenylenediamine,1,3-diamino-4-isopropylbenzene, 4,4′-oxydianiline (ODA),bis(aminophenoxy phenyl) sulfones (BAPS) and 4,4′-diamino diphenylsulfone (DDS). In some embodiments of bis(phthalimide) (9), X is chloroor fluoro, specifically chloro, and R is m-phenylene, p-phenylene, anarylene ether such as p,p-diphenylether, a diarylsulfone such asdiphenylsulfone, or a combination comprising at least one of theforegoing.

The substituted phthalic anhydride of formula (7), the organic diamineof formula (8), and diphenyl sulfone, sulfolane, or a combinationcomprising at least one of the foregoing solvents can be combined in anyorder. In an embodiment, the diphenyl sulfone is first heated to amolten state, then the substituted phthalic anhydride of formula (7),the organic diamine of formula (8) are added to the molten diphenylsulfone either alone, or in combination.

In an advantageous feature, the condensation of a substituted phthalicanhydride of formula (7) and an organic diamine of formula (8)(imidization) is conducted without any imidization catalysts typicallyused in imidization reactions.

The bis(phthalimide)s (9) are generally prepared at least at 130° C.,specifically 150° to 275° C., more specifically 160 to 250° C.Atmospheric or super-atmospheric pressures can be used, for example upto 5 atmospheres, to facilitate the use of high temperatures withoutcausing solvent to be lost by evaporation.

The reaction of the substituted phthalic anhydride (7) with the organicdiamine (8) to form bis(phthalimide) (9) is generally conducted for 0.5to 30 hours, specifically 1 to 20 hours, more specifically 1 to 10hours, still more specifically 2 to 8 hours, and yet more specifically 3to 7 hours. Advantageously, conversion to the bis(phthalimide) is 99%complete, based on the moles of the substituted phthalic anhydride, inless than 6 hours.

The diphenyl sulfone, sulfolane, or a combination comprising at leastone of the foregoing solvents, organic diamine (8), and substitutedphthalic anhydride (7) can be combined in amounts such that the totalsolids content during the reaction to form bis(phthalimide) (9) does notexceed 80 weight percent (wt. %), or does not exceed 60 wt. %. Forexample, the total solids content can be 1 to 40 wt. %, or 1 to 30 wt.%, or 1 to 25 wt. %. “Total solids content” expresses the proportion ofthe reactants as a percentage of the total weight including liquids suchas molten diphenyl sulfone, sulfolane, or a combination comprising atleast one of the foregoing solvents present in the reaction at any giventime.

In an embodiment, the amount of diphenyl sulfone or sulfolane isadjusted based on the amount of bis(phthalimide) (9). In particular, theamount is based on the weight of the bis(phthalimide) (9) divided by thesum of the weight of the bis(phthalimide) (9) plus the weight of thediphenyl sulfone or sulfolane as follows:

$\frac{{weight}\mspace{14mu} {of}\mspace{14mu} {{bis}({phthalimide})}\mspace{14mu} (9)}{\begin{matrix}{{{weight}\mspace{14mu} {of}\mspace{14mu} {{bis}({phthalimide})}\mspace{14mu} (9)} +} \\{{weight}\mspace{14mu} {of}\mspace{14mu} {diphenyl}\mspace{14mu} {sulphone}\mspace{14mu} {or}\mspace{14mu} {sulfolane}}\end{matrix}}(100)$

and can be 1 to 30%, specifically 15 to 25%, or 18 to 22%.

It can be desirable to have low water content in the imidizationreaction mixture. Thus, in some embodiments, the combined substitutedphthalic anhydride, organic diamine, and diphenyl sulfone, sulfolane, ora combination comprising at least one of the foregoing can comprise lessthan or equal to 200 parts per million parts of the combined componentsweight (ppm) of water, more specifically, less than or equal to 100 ppmof water, still more specifically, less than or equal to 50 ppm ofwater, or, yet more specifically, less than or equal to 25 ppm of water.In some embodiments, the combined substituted phthalic anhydride,organic diamine, and diphenyl sulfone, sulfolane, or a combinationcomprising at least one of the foregoing solvents comprise less than orequal to 100 ppm water.

A molar ratio of substituted phthalic anhydride (7) to diamine (8) of1.95:1 to 2.05:1, specifically 1.98:1 to 2.02:1, more specifically1.98:1 to 2.01:1, or 2:1 can be used. While other ratios can beemployed, a slight excess of anhydride can be desirable. A properstoichiometric balance between substituted phthalic anhydride (7) anddiamine (8) is maintained to prevent undesirable by-products that canlimit the molecular weight of the polyetherimide polymer prepared fromthe bis(phthalimide), and/or result in polymers with amine end groups.Accordingly, in an embodiment, the imidization process includescontacting diamine (8) with substituted phthalic anhydride (7) in thepresence of diphenyl sulfone, sulfolane, or a combination comprising atleast one of the foregoing solvents at a temperature of greater than130° C. to form a reaction mixture having a targeted initial molar ratioof substituted phthalic anhydride to diamine; further heating thereaction mixture; analyzing the molar ratio of the further heatedreaction mixture to determine the actual initial molar ratio ofsubstituted phthalic anhydride (7) to diamine (8); and, if necessary,adding substituted phthalic anhydride (7) or diamine (8) to the analyzedreaction mixture to adjust the molar ratio of substituted phthalicanhydride (7) to diamine (8) to the desired value, for example 1.98:1 to2.02:1.

In some embodiments, an endcapping agent is formed during imidization,or the imidization is conducted in the presence of an endcapping agent.The endcapping agent can be formed before or during imidization byaddition of a monofunctional reactant that reacts with one of the aminegroups of diamine (8), thereby “capping” the amine end group. Otherendcapping agents include phenates, for example the salts of anymonophenol, p-cumyl phenol. Such mono-capped diamines endcap the polymerduring polymerization, and thus can be used to control the molecularweight of the polymer or the end groups of the polymer. Accordingly, themonofunctional reactant has a functional group that reacts with an amineof diamine (8) for example, a phthalic anhydride, acyl alkyl halide,acyl aryl halide, aldehyde, ketone, ester, isocyanate, chloroformate,sulfonyl chloride, a phenate, and the like. A combination of differentmonofunctional reactants can be present. In an embodiment themonofunctional reactant is a phthalic anhydride without a halogen,nitrogen, or other leaving group substitution. For example, when acombination of substituted phthalic anhydride (7) and unsubstitutedphthalic anhydride are reacted with organic diamine (8), the productcomprises bis(phthalimide) (9) and monofunctional bis(phthalimide) (18)

wherein R and X are as defined in formula (9).

The amount of monofunctional reactant added will depend on the desiredamount of endcapping agent. For example, the amount of monofunctionalreactant present in the imidization reaction can be more than 0 to 10mole percent, specifically 1 to 10 mole percent, and more specificallyto 6 mole percent, based on total moles of substituted phthalicanhydride (7). The monofunctional reactant can be added at any time,e.g., to the diamine (8), the substituted phthalic anhydride (7), thesolvent, or a combination thereof, before or after imidization hasstarted, in the presence or absence of the imidization catalyst.

Alternatively, or in addition to the above monofunctional reactants, ormonofunctional bis(phthalimides) can be added as endcapping agents.Thus, in some embodiments, the method further comprises the directaddition of an endcapping agent such as a monofunctionalbis(phthalimide) (18). Thus, imidization can be conducted by stepwise,simultaneously or essentially simultaneously combining the reactants,i.e., substituted phthalic anhydride (7), organic amine (8), solvent,imidization catalyst, and the monofunctional reactant or endcappingagent such as a monofunctional bis(phthalimide).

The bis(phthalimide) composition comprising diphenyl sulfone can be usedfor the subsequent polymerization step, described below, withoutpurification. Alternatively, the bis(phthalimide) composition can besubject to further purification as is known in the art beforepolymerization.

Thus, after imidization, the leaving group X of bis(phthalimide) (9)

is displaced by reaction with an alkali metal salt of a dihydroxyaromatic compound of formula (10)

MO—Z—OM  (10)

wherein M is an alkali metal and Z is as described in formula (1), toprovide the polyetherimide of formula (1)

wherein n, R, and Z are as defined above.

Alkali metal M can be any alkali metal, for example lithium, sodium,potassium, and cesium. Thus alkali metal salt (10) is a lithium salt,sodium salt, potassium salt, cesium salt, or a combination comprising atleast one of the foregoing. Specific alkali metals are potassium orsodium. In preferred embodiments herein, M is potassium. The alkalimetal salt can be obtained by reaction of a metal hydroxide witharomatic C₆₋₂₄ monocyclic or polycyclic dihydroxy aromatic compoundoptionally substituted with 1 to 6 C₁₋₈ alkyl groups, 1 to 8 halogenatoms, or a combination thereof, for example a dihydroxy aromaticcompound of formula (11):

wherein R^(a), R^(b), and X^(a) are as described in formula (4). In someembodiments the dihydroxy aromatic compound is bisphenol A,hydroquinone, bisphenol, resorcinol, or a combination comprising atleast one of the foregoing. For example, the dihydroxy aromatic compoundcan be 2,2-bis(4-hydroxyphenyl) propane (“bisphenol A” or “BPA”). Thealkali metal salt can be used in a powder form or in a slurry form. Theslurry form of the alkali metal salt comprises an alkali metal saltdispersed in a solvent such as ortho-dichlorobenzene, toluene, moltendiphenyl sulfone, sulfolane, and xylenes. Once combined withbis(phthalimide) (9), the solvent in the slurry of alkali metal salt canbe removed before the polymerization reaction starts. In an embodiment,the slurry form comprises an alkali metal salt dispersed inortho-dichlorobenzene.

Advantageously, polymerization of bis(phthalimide) (9) in diphenylsulfone with alkali metal salt (10) can be conducted without thepresence of a polymerization catalyst. In another embodiment, thepolymerization is conducted in the presence of a polymerizationcatalyst. Examples of polymerization catalysts are the quaternaryammonium salts, quaternary phosphonium salts, guanadinium salts,pyridinium salts, imidazolium salts described above, in particularguanidinium salts. Examples of guanidinium salts arehexaalkylguanidinium and α,ω-bis(pentaalkylguanidinium)alkane salts, andan example of a hexaalkylguanidinium salt is hexaethylguanidiniumchloride.

If necessary, additional diphenyl sulfone can be added. Other non-polarsolvents, preferably with a boiling point above 100° C., specificallyabove 150° C., for example o-dichlorobenzene, dichlorotoluene,1,2,4-trichlorobenzene, a monoalkoxybenzene such as anisole, veratrole,diphenylether, or phenetole. Preferably polar aprotic solvents such asdimethylformamide (DMF), dimethylacetamide (DMAc), dimethylsulfoxide(DMSO), tetramethylene sulfone (sulfolane), or N-methylpyrrolidinone(NMP) are not used as a solvent or a co-solvent. In an embodiment, noNMP is present. In an embodiment, the polymerization is carried out indiphenyl sulfone and no other solvents are used. A total solids contentof the bis(phthalimide) (9) in the polymerization can be as describedabove, for example 15 to 25 wt. %, based on the total weight of thepolymerization mixture. “Total solids content” refers to the proportionof the reactants as a percentage of the total weight of thepolymerization mixture, including solvents, such as diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoingsolvent.

Polymerization can be conducted at least 110° C., specifically 150° to275° C., more specifically 160 to 250° C. Atmospheric orsuper-atmospheric pressures can be used, for example up to 5atmospheres, to facilitate the use of high temperatures without causingsolvent to be lost by evaporation.

The polymerization can be conducted for 0.5 to 30 hours, specifically 1to 20 hours, more specifically 1 to 10 hours, still more specifically 2to 8 hours, and yet more specifically 3 to 7 hours. The yellowness indexof polyetherimide (1) can depend on the polymerization time such thatthe longer the polymerization time, the higher the yellowness index.Thus it is generally desirable to minimize the polymerization time.

In some embodiments, the alkali metal salt (10) is added directly to thecomposition containing the bis(phthalimide) (9) and the diphenylsulfone, sulfolane, or a combination comprising at least one of theforegoing. Water removal from the system can be accomplished in eitherbatch, semi-continuous or continuous processes using means known in theart such as a distillation column in conjunction with one or morereactors. Other methods for water removal include passing the condenseddistillate through a drying bed for chemical or physical adsorption ofwater.

The molar ratio of the alkali metal salt (10) to the bis(phthalimide)(9) can be 0.94:1 to 1.0:1.0, specifically 0.96:1 to 0.99:1, and morespecifically 0.97:1 to 0.99:1. Adjusting this ratio allows adjustment ofthe molecular weight of the polymer.

The bis(phthalimide) composition and the polyetherimide composition canbe manufactured in separate vessels. Advantageously, since thebis(phthalimide) composition can be used directly in the polymerizationreaction without purification, the bis(phthalimide) composition and thepolyetherimide composition can be manufactured in the same vessel. Asdescribed above, in some embodiments an endcapping agent is formedduring imidization or added to the imidization. Alternatively, thepolymerization further comprises the addition of an endcapping agent.The endcapping agent can be phthalimide, the monofunctionalbis(phthalimide) (18), or a monofunctional alkali metal phenate. Theamount of the endcapping agent can vary. The endcapping agent can beadded stepwise, simultaneously or essentially simultaneously with thebis(phthalimide) (9) and the alkali metal salt (10).

After polymerization, the polymer is isolated. For example, the reactionmixture can be cooled, and the polymer solidified. The polymer can bebroken and ground to a powder, then slurried with a solvent misciblewith the diphenyl sulfone or sulfolane (e.g., acetone), and the polymerseparated from the acetone (e.g., by filtration or centrifugation) toremove residual diphenyl sulfone or sulfolane. Byproduct salt (e.g.,NaCl) can be removed from the product by the polymer washing with water,for example acidified water. The polymer can again be isolated (e.g.,filtered or centrifuged), dried (by, for example washing with acetone,followed by oven drying). For convenience, the polymer can then beextruded to form pellets. Other methods for isolation can be used, forexample quenching, followed by addition of a solvent such as methylenechloride to form a suspension and dissolve the polymer. Anycontaminating solid can be removed, and the polymer solution added to asolvent such as acetone to precipitate the polymer while leaving thediphenyl sulfone or sulfolane in solution with the acetone. The polymercan be further washed and dried.

In an embodiment, the polyetherimide compositions manufactured accordingto the methods of the disclosure contain greater than 0.1 parts permillion of diphenyl sulfone, sulfolane, or a combination comprising atleast one of the foregoing solvents, based on the total weight of thecomposition. For example, a sample of the polyetherimide compositionscan contain 0.1 to 10,000 parts per million of diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoingsolvents, or 1 to 1,000 parts per million of diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoingsolvents, or 0.1 to 100 parts per million of diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoingsolvents, each based on the total weight of the composition. In otherembodiments, the polyetherimide compositions can have greater than 1part per million of sodium or potassium based on the total weight of thecomposition. For example, a sample of the polyetherimide compositionscan contain 1 to 10,000 parts per million of d sodium or potassium, or10 to 10,000 parts per million of sodium or potassium, or 10 to 1,000parts per million of sodium or potassium, each based on the total weightof the composition. The polyetherimides can have a yellowness index ofless than 300 or less than 250, determined as described herein.

The polyetherimides can be formulated to provide a wide variety ofpolyetherimide compositions for the manufacture of articles. Thepolyetherimide compositions can optionally comprise a filler. In someinstances it is desired to have polyetherimide compositions wherein afiller is substantially absent. “Substantially absent” means that thecomposition has less than 3 wt. % of a filler, and in other embodimentsless than 1 wt. % filler by weight of the composition. In otherinstances, it is advantageous to have polyetherimide compositionswherein a filler is absent.

The polyetherimide compositions can include various additives ordinarilyincorporated into polymer compositions of this type, with the provisothat the additives are selected so as to not significantly adverselyaffect the desired properties of the composition. Exemplary additivesinclude catalysts, impact modifiers, fillers, antioxidants, thermalstabilizers, light stabilizers, ultraviolet light (UV) absorbingadditives, quenchers, plasticizers, lubricants, mold release agents,antistatic agents, visual effect additives such as dyes, pigments, andlight effect additives, flame retardants, anti-drip agents, andradiation stabilizers. In some embodiments, the polyetherimidecomposition comprises a solvent, and the composition is in the form of avarnish. Combinations of additives can be used, for example acombination of a heat stabilizer, a mold release agent, and optionallyan ultraviolet light stabilizer. In general, the additives are used inthe amounts generally known to be effective. The foregoing additives(except any fillers) are generally present in an amount from 0.005 to 20wt. %, specifically 0.01 to 10 wt. %, based on the total weight of thecomposition. Alternatively, in some embodiments, our compositions do notcontain appreciable amounts of additives, and in some embodiments, thereare no detectable amounts of additives, i.e., additives aresubstantially absent or absent from the compositions. Accordingly, theforegoing additives (except any fillers) can be individually present inan amount from 0.001 to 20 wt. %, 0.01 to 10 wt. %, or 0.01 to 5 wt. %,based on the total weight of the composition. In another embodiment, noappreciable amount of any additive other than a heat stabilizer, a moldrelease agent, and optionally an ultraviolet light stabilizer is presentin the compositions. In still another embodiment, no detectable amountof any additive other than a heat stabilizer, a mold release agent, andoptionally an ultraviolet light stabilizer is present in thecompositions.

In some embodiments, the polyetherimide composition can further includeat least one additional polymer. Examples of such additional polymersinclude and are not limited to PPSU (polyphenylene sulfone),polyetherimides, PSU (polysulfone), PPE (polyphenylene ether), PFA(perfluoroalkoxy alkane), MFA (co-polymer of TFE tetrafluoroethylene andPFVE perfluorinated vinyl ether), FEP (fluorinated ethylene propylenepolymers), PPS (poly(phenylene sulfide), PTFE (polytetrafluoroethylene),PA (polyamide), PBI (polybenzimidizole), PAI (poly(amide-imide)),poly(ether sulfone), poly(aryl sulfone), polyphenylene,polybenzoxazoles, polybenzthiazoles, as well as blends and co-polymersthereof. When present, the polymer is used in an amount from more than 0to 20 wt. %, specifically 0.1 to 15 wt. %, and more specifically from0.5 to 10 wt. %, all based on the total weight of the polyetherimidecomposition. In some embodiments, no polymer other than thepolyetherimide as described herein is present in the polyetherimidecomposition.

The polyetherimide composition can be prepared by blending theingredients under conditions for the formation of an intimate blend.Such conditions often include melt mixing in single or twin screw-typeextruders, mixing bowl, or similar mixing devices that can apply a shearto the components. Twin-screw extruders are often preferred due to theirmore intensive mixing capability and self-wiping capability, over singlescrew extruders. It is often advantageous to apply a vacuum to the blendthrough at least one vent port in the extruder to remove volatileimpurities in the composition. Often it is advantageous to dry thepolyetherimide composition prior to melt mixing. The melt mixing isoften done at 290 to 340° C. to avoid excessive polymer degradationwhile still allowing sufficient melting to get an intimate polymermixture free of any unbelted components. The polymer blend can also bemelt filtered using a 40 to 100 micrometer candle or screen filter toremove undesirable black specks or other heterogeneous contaminants.

In an exemplary process, the polyetherimide, any other polymers, and anyadditives are placed into an extrusion compounder to produce acontinuous strand that is cooled and then chopped into pellets. Inanother procedure, the components are mixed by dry blending, and thenfluxed on a mill and comminuted, or extruded and chopped. Thecomposition and any optional components can also be mixed and directlymolded, e.g., by injection or transfer molding techniques. Preferably,all of the components are freed from as much water as possible. Inaddition, compounding is carried out to ensure that the residence timein the machine is short; the temperature is carefully controlled; thefriction heat is utilized; and an intimate blend between the componentsis obtained.

The polyetherimide composition can be formed into an article by anynumber of methods including shaping, extruding (including profileextrusion), thermoforming, and molding, including injection molding,compression molding, gas assist molding, structural foam molding, andblow molding. In some embodiments, a method of forming an articlecomprises shaping, extruding, blow molding, or injection molding thecomposition to form the article. The polyetherimide compositions canalso formed into articles using thermoplastic processes such as filmextrusion, sheet extrusion, melt casting, blown film extrusion, andcalendaring. Co-extrusion and lamination processes can be used to formcomposite multi-layer films or sheets. The article is a sheet, film,multilayer sheet, multilayer film, molded part, extruded profile, coatedpart, pellets, powder, foam, fiber, fibrids, flaked fibers, or acombination comprising at least one of the foregoing.

The polyetherimide composition can be molded into an article with anyequipment conventionally used for molding thermoplastic compositions,such as a Newbury or van Dorn type injection-molding machine withconventional cylinder temperatures of 250° C. to 320° C., andconventional mold temperatures of 55° C. to 120° C.

It is appreciated that in an embodiment, tetramethylene sulfone(sulfolane) can be used as an alternative to diphenyl sulfone.Accordingly, whenever diphenyl sulfone is mentioned, it can be replacedwith tetramethylene sulfone (sulfolane).

The methods of the manufacture of bis(phthalimide) and polyetherimidecompositions are further illustrated by the following non-limitingexamples.

EXAMPLES Materials

The materials in Table 1 were used or made in the following Examples andComparative Examples.

TABLE 1 Acronym Description Source BPA 2,2-Bis(4-hydroxyphenyl)propane,Hexion (Bisphenol A) BP Bisphenol K₂BPA Bisphenol, dipotassium saltExamples Na₂BPA Bisphenol, disodium salt Examples KOH Potassiumhydroxide Acculute IPA Isopropyl alcohol Aldrich DPS Diphenyl sulfoneDDS Diaminodiphenyl sulfone o-DCB ortho-Dichlorobenzene Fischer ClPAMixture of 3-chlorophthalic anhydride and 4- SABIC chlorophthalicanhydride 3ClPA 3-Chlorophthalic anhydride 4ClPA 4-Chlorophthalicanhydride mPD meta-Phenylene diamine DuPont pPD para-Phenylene diamineODA Oxydianiline AcOH Acetic acid Aldrich ClPAMI 1,3-bis[N-(3- or 4-Examples chlorophthalimido)]benzene 3ClPAMI 1,3- or 1,4-bis[N-(3-Examples Chlorophthalimido)]benzene 4ClPAMI 1,3- or 1,4-bis[N-(4-Examples Chlorophthalimido)]benzene 4ClPAMIDPE4,4′-bis[N-(4-Chlorophthalimido)]diphenyl Examples ether 3ClPAMIDPE4,4′-bis[N-(3-Chlorophthalimido)]diphenyl Examples ether 3ClPAMIDPS4,4′-bis[N-(3-Chlorophthalimido)]diphenyl Examples sulfone 4ClPAMIDPS4,4′-bis[N-(4-Chlorophthalimido)]diphenyl Examples sulfone PA Phthalicanhydride NaPCP Sodium para-cumyl phenol HEGCl Hexaethyl guanidiniumchloride PEI Polyetherimide Examples H₃PO₄ Phosphoric acid Fischer

Weight average molecular weight (Mw) of the polymer product wasdetermined by gel permeation chromatography (GPC) using polystyrenestandards.

In a 20 ml glass vial, about 20 mg of the polymer sample was taken anddissolved into a quench solution (3.5 L CH₂Cl₂+120 mL AcOH+30 mL o-DCB)followed by filtration with 0.25 micron filter into an HPLC vial. Thesolution was analyzed by GPC with polystyrene standard (HPLC 2695,Waters GPC software using 2487 Dual absorbance detector of wavelength254 nm and Mixed Bed C, PLgel 5 micrometer, 300×7.5 mm, P/N 1110-6500column).

The yellowness index of the polyetherimide was determined by measuringthe YI of a solution of the polymer (about 2 g diluted up to 100 mLusing an acetonitrile-water mixture (60:40 mix by volume) on a GretagMacbeth Color Eye 7000A instrument. The instrument reading was referredto as solution YI. The YI values reported are predicted plaque YIcalculated based on the following correlation of Eq. (2):

Predicted Plaque YI=(Solution YI+18.2)/0.5986  (2))

BPAK₂ Powder

A 500 mL 3-neck round bottomed flask (24/40) was equipped with anoverhead stirrer through its center joint. One of the side joints wasconnected to a nitrogen sweep while the other was connected to anitrogen blanket connected to a bubbler via a Dean-Stark trap with itsarm wrapped in a heating tape. The flask was then charged with 11.4145 gBPA (0.05 moles, 1 equiv.) and 0.1 moles aqueous KOH solution(Acculute). The overhead stirrer was turned on and the flask wasimmersed into the oil bath at 80° C. The stirring was continued for 1 h.Another 500 mL 3-neck flask with the above set-up was charged with 200mL o-DCB and heated to 160° C. The aqueous salt solution was slowlycannulated into the flask containing o-DCB. After stripping off majorityof the water, the salt started to crash out as solid in the wall of theflask. The temperature of the flask was then decreased to 100° C. and100 mL IPA was added slowly while stirring. The solid dissolved again.Upon stripping of the solvents while slowly increasing the temperatureto 160° C., the solution started to become cloudy and then to a slurryin o-DCB. The salt was converted into a dry powder by further strippingoff o-DCB and placing it into a vacuum oven at 150° C. for 12 h.

BPANa₂ Slurry

A 500 mL 3-neck round bottomed flask (24/40) was equipped with anoverhead stirrer through its center joint. One of the side joints wasconnected to a nitrogen sweep while the other was connected to anitrogen blanket connected to a bubbler via a Dean-Stark trap with itsarm wrapped in a heating tape. The flask was then charged with 11.4145 gBPA (0.05 moles, 1 equiv.) and 0.1 moles aqueous KOH solution(Acculute). The overhead stirrer was turned on and the flask wasimmersed into the oil bath at 80° C. The stirring was continued for 1 h.Another 500 mL 3-neck flask with the above set-up was charged with 200mL o-DCB and heated to 160° C. The aqueous salt solution was slowlycannulated into the flask with o-DCB. The water and o-DCB was strippedoff into the Dean-Stark with the nitrogen sweep while the salt slurrywas forming. The stripping off continued until the Karl-Fisher analysisshowed the moisture level <50 ppm in the overheads distillate.

Example 1

This example demonstrates the synthesis of ClPAMI from ClPA and mPD indiphenyl sulfone without using other solvents. The ClPAMI compositioncontaining diphenyl sulfone can be reacted with BPAK₂ powder directlywithout purification. No catalyst is needed for the polymerization.

A 500 mL 3-neck round bottomed flask (24/40) was equipped with anoverhead stirrer through its center joint. One of the side joints wasconnected to a nitrogen sweep while the other was connected to anitrogen blanket connected to a bubbler via a Dean-Stark trap with itsarm wrapped in a heating tape. The flask was then immersed into an oilbath at 170° C. and DPS (50 g) was added. Once the DPS was completelymolten, stirrer was turned on and 2.671 g m-PD (0.0247 moles, 1.0equiv.) and 9.054 g ClPA (0.0496 moles, 2.008 equiv.) were added intothe molten DPS (making it ˜18% solid) at 170° C. and the temperature wasslowly increased to 200° C. The initial solution converted into a thickwhite slurry of ClPAMI. The heating was continued for 3 h and the slurrybecame slightly thinner.

To the stirring slurry of ClPAMI (10.8 g, 0.0247 moles, 1 equiv.), K₂BPAsalt powder (7.308 g, 95.7% solid, 0.024 moles, 0.93 equiv.) was added.The temperature of the reaction mixture was increased from 170° C. to220° C. The mixture first became thick solid and then became thinner. Mwbuild was monitored by GPC analysis. The salt addition was made twice tomake 0.95 (2.5 h) and finally 0.97 (4.5 h) molar ratio with respect toClPAMI. The Mw of polyetherimide as a function of time is shown in FIG.1.

The reaction was quenched with phosphoric acid (85%, 670 mg) at 170° C.and stirred for 30 min. The mixture was then transferred into a 500 mLflask with a Teflon cap and cooled. Methylene chloride (200 mL) wasadded into the solidified polymer solution. The mixture was shaken toconvert the solid into a suspension. The suspension was filtered through2.7 micron filter paper in a Buchner Funnel to remove the precipitatedsolid. The clear polymer solution in DPS and methylene chloride wasslowly added to 300 mL acetone with constant agitation by a homogenizerto precipitate the polyetherimide which was filtered and washed with 200mL acetone to provide a polyetherimide powder, which was subsequentlydried in vacuum at room temperature.

Example 2

This example demonstrates that the ClPAMI composition containingdiphenyl sulfone can be reacted with BPANa₂ slurry directly withoutpurification. No catalyst is needed for the polymerization.

A slurry of BPANa₂ in o-DCB made in a separate flask was added to theClPAMI slurry made as shown in example 1. Then o-DCB was stripped offinto Dean-Stark with the help of heating tape and nitrogen sweep. OnceODCB was removed, polymerization started. The Mw was monitored in GPCwith polystyrene standard. Decreasing the molar ratio of salt and ClPAMIdecreased the Mw of polyetherimide, showing the possibility of Mwcontrol. The results are shown in FIG. 2. Polyetherimide was quenchedand isolated following the same procedure as shown in Example 1.

Example 3—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and Metaphenylene Diamine (mPD) in DPS Using Na₂BPA Salt Slurry ino-DCB

A 500 mL 3-neck round bottomed flask (24/40) was equipped with anoverhead stirrer. The flask was also connected to a nitrogen sweep and anitrogen blanket. The nitrogen blanket was connected to a bubbler via aDean-Stark trap with its arm wrapped in a heating tape. The flask wasthen immersed into an oil bath at 170° C. and DPS (100 g) was added.Once the DPS was completely molten, stirrer was turned on and 5.409 gm-PD (0.05 moles, 1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008equiv.) were added into the molten DPS (making it about 18% solid) at170° C. and the temperature was slowly increased to 200° C. The initialsolution converted into a thick white slurry of 4ClPAMI in DPS. Theheating was continued for 4 h and the slurry became slightly thinner. Atthat point, the stoichiometry analysis of the reaction mixture showedthe presence of 0.37 mol % of residual 4ClPA and 0.49 mol % of residualmonoamine in the reaction mixture.

To the stirring slurry of 4ClPAMI, Na₂BPA salt slurry (94.31 g, 14.0%solid in o-DCB, 0.0485 moles, 0.97 equiv.) was added. The temperature ofthe reaction mixture was increased from 170° C. to 200° C. The heatingtape on the arm of the Dean-Stark trap was turned on and the o-DCB wasremoved from the reaction mixture with the help of nitrogen sweep. GPCanalysis with polystyrene standard showed the Mw plateau of 58018 D in18 hours with PDI of 2.69.

The reaction was quenched with phosphoric acid (85%, 670 mg) at 170° C.and stirred for 30 min, and transferred into an aluminum pan to coolinto room temperature. The solid polymer mixture was broken into piecesand dissolved in 200 mL methylene chloride. The solution was filteredthrough 0.7μ porous filter paper to remove the salt. The solution wasprecipitated in 500 mL acetone filtered and washed with acetone (2×500ml) and the filtered cake was dried in vacuum oven. The polymer had a Tgof 215° C. and YI of 133.

Example 4—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and mPD in DPS Using Na₂BPA Salt Slurry in o-DCB in the Presenceof Phase Transfer Catalyst HEGCl

Following the procedure described in example 3, 5.409 g m-PD (0.05moles, 1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 4ClPAMI with 4ClPA and monoamine residuesrespectively 0.31 and 0.34 mol %. To the stirring slurry of 4ClPAMI,Na₂BPA salt slurry (87.79 g, 15.04% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added followed by the addition of HEGCl (0.659 g, 0.0005moles, 0.01 equiv). GPC analysis with polystyrene standard showed the Mwplateau of 55083 D in 8 hours with PDI 2.97.

The polymer mixture was poured into an aluminum pan without quenchingand allowed to cool. The solidified polymer solution was broken intopieces and powdered with the help of blender. The polymer was washedwith acetone (3×500 mL) and cake was mixed with 500 mL pH 2 DI water(acidified with HCl) and shaken for 30 min followed by filtration andthe washing with DI water (3×500 mL). The polymer cake was finallywashed with additional 100 mL acetone and dried in vacuum oven at 150°C. The isolated polymer has 50 ppm residual sodium ions, Tg of 221° C.,and 98 ppm of OH.

Example 5—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and mPD in DPS Using Na₂BPA Salt Slurry in o-DCB and PhthalicAnhydride (PA) as Chain Stopper

Following the procedure described in example 3, 5.409 g m-PD (0.5 moles,1.0 equiv.) and 18.237 g 4ClPA (0.0999 moles, 1.998 equiv.) and 74 mg PA(0.05 mmol, 0.01 equiv) were used to synthesize 4ClPAMI with 4ClPA andmonoamine residues respectively 0.67 and 0.31 mol %. To the stirringslurry of ClPAMI, Na₂BPA salt slurry (88.04 g, 15% solid in o-DCB,0.0485 moles, 0.97 equiv.) was added. GPC analysis with polystyrenestandard showed the Mw plateau of 49377 D in 8 hours with PDI 2.94. Thepolymer was isolated as described in example 4 and had a Tg of 219° C.and 440 ppm OH.

Example 6—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and mPD in DPS Using Na₂BPA Salt Slurry in o-DCB and NaPCP asChain Stopper

Following the procedure described in example 3, 5.409 g m-PD (0.5 moles,1.0 equiv.) and 18.237 g 4ClPA (0.0999 moles, 1.998 equiv.) were used tosynthesize 4ClPAMI with 4ClPA and monoamine residues respectively 0.53and 0.31 mol %. To the stirring slurry of 4ClPAMI, Na₂BPA salt slurry(88.04 g, 15% solid in o-DCB, 0.0485 moles, 0.97 equiv.) and NaPCP (234mg, 15% solid in O-DCB, 1.0 mmol, 0.02 equiv) was added. GPC analysiswith polystyrene standard showed the Mw plateau of 43370 D in 21 hourswith PDI 2.35.

The reaction was quenched with phosphoric acid (85%, 670 mg) at 170° C.and stirred for 30 min. The mixture was then transferred into analuminum pan and cooled to room temperature. The solidified polymersolution was broken into pieces and powdered with the help of blender.The powdered polymer mixture was washed with acetone (3×500 mL) followedby the washing with DI water (3×500 mL). The final polymer was washedwith additional 100 mL acetone and dried in vacuum oven at 150° C. Thepolymer was characterized as follows: Tg 220° C.; OH 479 ppm; and YI 96.

Example 7—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and mPD in DPS Using Na₂BPA Salt Slurry in o-DCB and KP to ReduceOH End Groups

Following the procedure described in example 3, 5.409 g m-PD (0.05moles, 1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 4ClPAMI with 4ClPA and monoamine residuesrespectively 0.31 and 0.34 mol %. To the stirring slurry of 4ClPAMI,Na₂BPA salt slurry (94.65 g, 13.95% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added followed by the addition of KP (0.296 g). GPC analysiswith polystyrene standard showed the Mw plateau of 55083 D in 8 hourswith PDI 2.97. The polymer was isolated as described in example 4 andhad YI of 93, 245 OH end groups and 203 ppm sodium ions.

Example 8—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and mPD in DPS Using Na₂BPA Salt Slurry in o-DCB and Na₂CO₃ toReduce OH End Groups

Following the procedure described in example 3, 5.409 g m-PD (0.05moles, 1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 4ClPAMI with 4ClPA and monoamine residuesrespectively 0.40 and 0.54 mol %. To the stirring slurry of 4ClPAMI,Na₂BPA salt slurry (88.04 g, 15.0% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added followed by the addition of Na₂CO₃ (0.23 g). GPCanalysis with polystyrene standard showed the Mw plateau of 48371 D in21 hours with PDI 2.45. The polymer was isolated as described in example6 and had 432 ppm OH end groups and 198 ppm sodium ions.

Example 9—Synthesis of PEI from Polymerization of 3ClPAMI Derived from3ClPA and mPD in DPS Using Na₂BPA Salt Slurry in o-DCB

Following the procedure described in example 3, 5.409 g m-PD (0.05moles, 1.0 equiv.) and 18.329 g 3ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 3ClPAMI with 3ClPA and monoamine residuesrespectively 0.74 and 0.31 mol %. To the stirring slurry of 3ClPAMI,Na₂BPA salt slurry (94.65 g, 13.95% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added. GPC analysis with polystyrene standard showed the Mwplateau of 59766 D in 15 hours with PDI 2.80. The polymer was isolatedas described in example 3. The cyclics (n=1) in this case was 0.35% withrespect to the polymer area in the GPC. The polymer had a Tg of 237° C.and 437 ppm OH end groups.

Example 10—Synthesis of PEI from Polymerization of 3ClPAPI Derived from3ClPA and Paraphenylene Diamine (pPD) in DPS Using Na₂BPA Salt Slurry ino-DCB

Following the procedure described in example 3, 5.409 g pPD (0.05 moles,1.0 equiv.) and 18.329 g 3ClPA (0.1004 moles, 2.008 equiv.) were used tosynthesize 3ClPAPI with 3ClPA and monoamine residues respectively 0.67and 0.22 mol %. To the stirring slurry of 3ClPAPI, Na₂BPA salt slurry(96.38 g, 13.7% solid in o-DCB, 0.0485 moles, 0.97 equiv.) was added.GPC analysis with polystyrene standard showed the Mw plateau of 48235 Din 14 hours with PDI 2.55. The polymer was isolated as described inexample 5. The Tg of the polymer was 244° C.

Example 11—Synthesis of PEI from Polymerization of 4ClPAPI Derived from4ClPA and Paraphenylene Diamine (pPD) in DPS Using Na₂BPA Salt Slurry ino-DCB

Following the procedure described in example 3, 5.409 g pPD (0.05 moles,1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008 equiv.) were used tosynthesize 4ClPAPI with 4ClPA and monoamine residues respectively 0.55and 0.9 mol %. To the stirring slurry of 4ClPAPI, Na₂BPA salt slurry(97.37 g, 13.7% solid in o-DCB, 0.049 moles, 0.98 equiv.) was added. GPCanalysis with polystyrene standard showed the Mw plateau of 67171 D in 4hours with PDI 2.67. The polymer was isolated as described in example 6and had a Tg of 226° C. and 40 ppm sodium ions.

Example 12—Synthesis of PEI from Polymerization of 3ClPAMIDPE Derivedfrom 3ClPA and Oxydianiline (ODA) in DPS Using Na₂BPA Salt Slurry ino-DCB

Following the procedure described in example 3, 10.012 g ODA (0.05moles, 1.0 equiv.) and 18.329 g 3ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 3ClPAMIDPE. To the stirring slurry of 3ClPAMIDPE,Na₂BPA salt slurry (96.38 g, 13.7% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added. GPC analysis with polystyrene standard showed the Mwplateau of 66581 D in 6 hours with PDI 2.31. The polymer was isolated asdescribed in example 3 and was characterized as follows: Tg, 234° C.;OH, 422 ppm; and YI, 178.

Example 13—Synthesis of PEI from Polymerization of 4ClPAMIDPE Derivedfrom 4ClPA and Oxydianiline (ODA) in DPS Using Na₂BPA Salt Slurry ino-DCB

Following the procedure described in example 3, 10.012 g ODA (0.05moles, 1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 4ClPAMIDPE. To the stirring slurry of 4ClPAMIDPE,Na₂BPA salt slurry (96.38 g, 13.7% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added. GPC analysis with polystyrene standard showed the Mwplateau of 69673 D in 23 hours with PDI 2.42. The polymer was isolatedas described in example 4.

Example 14—Synthesis of PEI from Polymerization of 3ClPAMIDPS Derivedfrom 3ClPA and 4,4′-Diaminodiphenyl Sulfone (DDS) in DPS Using Na₂BPASalt Slurry in o-DCB

Following the procedure described in example 3, 12.415 g4,4′-diaminodiphenyl sulfone, DDS (0.05 moles, 1.0 equiv.) and 18.329 g3ClPA (0.1004 moles, 2.008 equiv.) were used to synthesize 3ClPAPIDPS.To the stirring slurry of 3ClPAMIDPS, Na₂BPA salt slurry (88.04 g, 15.0%solid in o-DCB, 0.0485 moles, 0.97 equiv.) was added. GPC analysis withpolystyrene standard showed the Mw plateau of 45643 D in 23 hours withPDI 2.12. The polymer was isolated as described in example 6 and had 505ppm OH end group 505 ppm and 10 ppm sodium ion.

Example 15—Synthesis of PEI from Polymerization of 4ClPAMIDPS Derivedfrom 4ClPA and 4,4′-Diaminodiphenyl Sulfone (DDS) in DPS Using Na₂BPASalt Slurry in o-DCB

Following the procedure described in example 3, 12.415 g4,4′-diaminodiphenyl sulfone, DDS (0.05 moles, 1.0 equiv.) and 18.329 g4ClPA (0.1004 moles, 2.008 equiv.) were used to synthesize 4ClPAMIDPS.To the stirring slurry of 4ClPAMIDPS, Na₂BPA salt slurry (88.04 g, 15.0%solid in o-DCB, 0.0485 moles, 0.97 equiv.), was added. GPC analysis withpolystyrene standard showed the Mw plateau of 41799 D in 16 hours withPDI 2.22. The polymer was isolated as described in example 4.

Example 16—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and Meta-Phenylene Diamine (mPD) in Sulfolane Using Na₂BPA SaltSlurry in o-DCB

A 500 mL 3-neck round bottomed flask (24/40) was equipped with anoverhead stirrer. The flask was also connected to a nitrogen sweep and anitrogen blanket. The nitrogen blanket was connected to a bubbler via aDean-Stark trap with its arm wrapped in a heating tape. The flask wascharged with 5.409 g m-PD (0.05 moles, 1.0 equiv.) and 18.329 g 4ClPA(0.1004 moles, 2.008 equiv.) followed by the addition of warm sulfolane(making it ˜18% solid) at 170° C. and the temperature was slowlyincreased to 200° C. The initial solution converted into a thick whiteslurry of 4ClPAMI in sulfolane. The heating was continued for 4 h andthe slurry became slightly thinner. At that point, the stoichiometryanalysis of the reaction mixture showed the presence of 0.82 mol % ofresidual 4ClPA and 0.94 mol % of residual monoamine in the reactionmixture.

To the stirring slurry of 4ClPAMI, Na₂BPA salt slurry (97.37 g, 13.7%solid in o-DCB, 0.049 moles, 0.98 equiv.) was added. The temperature ofthe reaction mixture was increased from 170° C. to 200° C. The heatingtape on the arm of the Dean-Stark trap was turned on and the o-DCB wasstripped off the reaction mixture with the help of nitrogen sweep. GPCanalysis with polystyrene standard showed the Mw plateau of 51204 D in12 hours with PDI 2.91. The polymer was isolated as described in example3. The polymer contained 19 ppm sodium ion and had a Tg of 219° C.

Example 17—Synthesis of PEI from Polymerization of 3ClPAMI Derived from3ClPA and Meta-Phenylene Diamine (mPD) in Sulfolane Using Na₂BPA SaltSlurry in o-DCB

Following the procedure described in example 16, 5.409 g m-PD (0.05moles, 1.0 equiv.) and 18.329 g 3-ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 3ClPAMI. To the stirring slurry of 3ClPAMI, Na₂BPAsalt slurry (97.37 g, 13.7% solid in o-DCB, 0.049 moles, 0.98 equiv.)was added. GPC analysis with polystyrene standard showed the Mw plateauof 45150 D in 8 hours with PDI 2.4. The polymer contained 0.7% cyclic(n=1) based on the area under the curve in GPC. The polymer was isolatedas described in example 3. The polymer contained 788 ppm Na ion and hadthe following properties: Tg 234° C. and YI 244.

Example 18—Synthesis of PEI from Polymerization of 3ClPAMI Derived from3ClPA and Paraphenylene Diamine (pPD) in Sulfolane Using Na₂BPA SaltSlurry in o-DCB

Following the procedure described in example 16, 5.409 g pPD (0.05moles, 1.0 equiv.) and 18.329 g 3ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 3ClPAPI. To the stirring slurry of 3ClPAPI, Na₂BPAsalt slurry (97.37 g, 13.7% solid in o-DCB, 0.049 moles, 0.98 equiv.)was added. GPC analysis with polystyrene standard showed the Mw plateauof 42773 D in 11 hours with PDI 2.62. The polymer was isolated asdescribed in example 6. The polymer contained 110 ppm of sodium ion andhad a Tg of 226° C.

Example 19—Synthesis of PEI from Polymerization of 3ClPAMIDPE Derivedfrom 3ClPA and 4,4′-Oxydianiline (ODA) in Sulfolane Using Na₂BPA SaltSlurry in o-DCB

Following the procedure described in example 16, 10.02 g 4,4′-ODA (0.05moles, 1.0 equiv.) and 18.329 g 3ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 3ClPAMIDPE. To the stirring slurry of 3ClPAMIDPE,Na₂BPA salt slurry (96.38 g, 13.7% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added. GPC analysis with polystyrene standard showed the Mwplateau of 51843 D in 10 hours with PDI 2.39. The polymer was isolatedas described in example 6.

Example 20—Synthesis of PEI from Polymerization of 4ClPAMIDPE Derivedfrom 4ClPA and 4,4′-Oxydianiline (ODA) in Sulfolane Using Na₂BPA SaltSlurry in o-DCB

Following the procedure described in example 16, 10.02 g 4,4′-ODA (0.05moles, 1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 4ClPAMIDPS. To the stirring slurry of 4ClPAMIDPS,Na₂BPA salt slurry (96.38 g, 13.7% solid in o-DCB, 0.0485 moles, 0.97equiv.) was added. GPC analysis with polystyrene standard showed the Mwplateau of 49547 D in 10 hours with PDI 2.27. The polymer was isolatedas described in example 6. The OH end groups were 684 ppm.

Example 21—Synthesis of PEI from Polymerization of4,4′-Bis[N-(3,4-Chlorophthalimido)]Diphenyl Ether (3,4ClPAMIDPE) Derivedfrom 30:70 Mixture of 3 and 4-Chlorophthalic Anhydride (3/4ClPA) and4,4′-Oxydianiline (ODA) in Sulfolane Using Na₂BPA Salt Slurry in o-DCB

Following the procedure described in example 16, 10.02 g 4,4′-ODA (0.05moles, 1.0 equiv.), 12.779 g 4ClPA (0.07 moles, 1.4 equiv.) and 5.477 g3ClPA (0.03 moles, 0.6 equiv) were used to synthesize 3,4′-ClPAMIDPE. Tothe stirring slurry of 3,4′-ClPAMIDPE, Na₂BPA salt slurry (96.38 g,13.7% solid in o-DCB, 0.0485 moles, 0.97 equiv.) was added. GPC analysiswith polystyrene standard showed the Mw plateau of 52259 D in 8 hourswith PDI 2.23. The polymer was isolated as described in example 6. Thepolymer contained 642 ppm sodim ion and 586 ppm OH end groups. The Tg ofthe polymer was 223° C.

Example 22—Synthesis of PEI from Polymerization of1,3-Bis[N-(3,4-Chlorophthalimido)]Benzene (3,4ClPAMI) Derived fromMixture of 3 and 4-Chlorophthalic Anhydride (3/4ClPA) and MetaphenyleneDiamine (mPD) in Sulfolane Using Na₂BPA Salt Slurry in o-DCB

Following the procedure described in example 16, 5.409 g mPD (0.05moles, 1.0 equiv.), 12.779 g 4ClPA (0.07 moles, 1.4 equiv.) and 5.477 g3ClPA (0.03 moles, 0.6 equiv) were used to synthesize 3,4′-ClPAMI. Tothe stirring slurry of 3,4′-ClPAMI, Na₂BPA salt slurry (96.38 g, 13.7%solid in o-DCB, 0.0485 moles, 0.97 equiv.) was added. GPC analysis withpolystyrene standard showed the Mw plateau of 48720 D in 11 hours withPDI 2.44. The polymer was isolated as described in example 6. Thepolymer contained 585 ppm sodium ions and had a Tg of 220° C.

Example 23—Synthesis of PEI from Polymerization of 3ClPAMIDPE Derivedfrom 3ClPA and 4,4′-Oxydianiline (ODA) in Sulfolane Using Na₂BPA SaltSlurry in Made in Sulfolane

A 1000 mL 3-neck round bottomed flask (24/40) was equipped with anoverhead stirrer. The flask was also connected to a nitrogen sweep and anitrogen blanket. The nitrogen blanket was connected to a bubbler via aDean-Stark trap with its arm wrapped in a heating tape. The flask wasthen charged with 93.1035 g biphenol (BP) (0.5 moles, 1 equiv.) and 1.0moles aqueous NaOH solution. The overhead stirrer was turned on and theflask was immersed into the oil bath at 100° C. The stirring wascontinued for 1 h. To the aqueous solution of Na₂BPA at 100° C., 500 mLwarm Sulfolane was added under nitrogen atmosphere and the mixture washeated slowly to 170° C. while stirring stripping off water andsulfolane mixture. The mixture becomes soluble at 130° C. and startsbecoming white slurry after the removal of significant amount of water.Additional 300 mL sulfolane was used while stripping off the water toensure the complete removal of water. The salt was used for thepolymerization.

Following the procedure described in example 16, 10.02 g 4,4′-ODA (0.05moles, 1.0 equiv.) and 18.329 g 3ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 3ClPAMIDPE. To the stirring slurry of 3ClPAMIDPE,solid Na₂BPA salt slurry (80.56 g, 14% solid in sulfolane, 0.049 moles,0.98 equiv.) synthesized as described above, was added. GPC analysiswith polystyrene standard showed the Mw plateau of 51393 D in 6 hourswith PDI 2.32. The polymer was isolated as described in example 6.

Example 24—Synthesis of PEI from Polymerization of 3ClPAMIDPE Derivedfrom 3ClPA and 4,4′-Oxydianiline (ODA) in DPS Using Na₂BPA Salt SlurryMade in o-DCB

A 500 mL 3-neck round bottomed flask (24/40) was equipped with anoverhead stirrer. The flask was also connected to a nitrogen sweep and anitrogen blanket. The nitrogen blanket was connected to a bubbler via aDean-Stark trap with its arm wrapped in a heating tape. The flask wasthen charged with 46.55 g BP (0.25 moles, 1 equiv.) and 0.5 molesaqueous NaOH solution. 100 mL water and 300 mL methanol were added tothe mixture to make the mixture soluble. The overhead stirrer was turnedon and the flask was immersed into the oil bath at 70° C. The stirringwas continued for 1 h. Another 1000 mL 3-neck flask with the aboveset-up was charged with 500 mL o-DCB and heated to 140° C. Theaqueous/methanol salt solution was slowly cannulated into the flask witho-DCB. The azeotropic mixture of water, methanol, and o-DCB wascollected into the Dean-Stark with the nitrogen sweep while the saltslurry was forming. Removal of water and oDCB continued until theKarl-Fisher analysis of the overhead condensate showed the moisturelevel <50 ppm.

Following the procedure described in example 3, 10.02 g 4,4′-ODA (0.05moles, 1.0 equiv.) and 18.329 g 3ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 3ClPAMIDPE. To the stirring slurry of 3ClPAMIDPE,solid Na₂BPA salt slurry (112.78 g, 10% solid in oDCB, 0.049 moles, 0.98equiv.) synthesized as described above, was added. GPC analysis withpolystyrene standard showed the Mw plateau of 59373 D in 13 hours withPDI 2.25. The polymer was isolated as described in example 6.

Example 25—Synthesis of PEI from Polymerization of 4ClPAMI Derived from4ClPA and Metaphenylene Diamine (mPD) in NMP Using Na₂BPA Salt Slurry inToluene

Following the procedure described in example 3, 5.409 g m-PD (0.05moles, 1.0 equiv.) and 18.329 g 4ClPA (0.1004 moles, 2.008 equiv.) wereused to synthesize 4ClPAMI. The reaction leaves large amount ofunreacted 4ClPA and monoamine residues even after 24 h. To the stirringslurry of ClPAMI, Na₂BPA salt slurry (87.79 g, 15.04% solid in toluene,0.0485 moles, 0.97 equiv.) in toluene was added. The mixture turned redand eventually dark red in 3 h. GPC analysis with polystyrene standardshowed the Mw plateau of 11010 Dalton in 8 hours with PDI 1.96.

Further included in this disclosure are the following specificembodiments, which do not necessarily limit the claims.

Embodiment 1

A method for the manufacture of a polyetherimide composition, the methodcomprising contacting a substituted phthalic anhydride and an organicdiamine in the presence of diphenyl sulfone or sulfolane or acombination comprising at least one of the foregoing solvents at atemperature of greater than 130° C., wherein the substituted phthalicanhydride has a formula (7), and the organic diamine has a formulaH₂N—R—NH₂ to provide a bis(phthalimide) composition comprising diphenylsulfone or sulfolane or a combination comprising at least one of theforegoing solvent and a bis(phthalimide) of the formula (9) andpolymerizing the bis(phthalimide) and an alkali metal salt of adihydroxy aromatic compound of the formula MO—Z—OM in the presence ofdiphenyl sulfone or sulfolane or a combination comprising at least oneof the foregoing solvents to form a polyetherimide of the formula (1)wherein in the foregoing formulae X is fluoro, chloro, bromo, iodo,nitro, or a combination comprising at least one of the foregoing; R isan aromatic hydrocarbon group having 6 to 27 carbon atoms, a halogenatedderivative thereof, a straight or branched chain alkylene group having 2to 10 carbon atoms, a halogenated derivative thereof, a cycloalkylenegroup having 3 to 20 carbon atoms, a halogenated derivative thereof,—(C₆H₁₀)_(z)— wherein z is an integer from 1 to 4, an aromatichydrocarbyl moiety having from 1 to 6 aromatic groups, and a divalentgroup of formula (2) wherein Q¹ is —O—, —S—, —C(O)—, —SO₂—, —SO—,—C_(y)H_(2y)— wherein y is an integer from 1 to 5, or a combinationcomprising at least one of the foregoing; M is an alkali metal; Z is anaromatic C₆₋₂₄ monocyclic or polycyclic moiety optionally substitutedwith 1 to 6 C₁₋₈ alkyl groups, 1 to 8 halogen atoms, or a combinationcomprising at least one of the foregoing; and n is an integer greaterthan 1.

Embodiment 2

The method of embodiment 1, wherein the stoichiometric ratio of thesubstituted phthalic anhydride to the organic diamine is 1.95:1 to2.05:1, and the stoichiometric ratio of the bis(phthalimide) to thealkali metal salt of the dihydroxy aromatic compound is 0.9:1 to 1.1:1.

Embodiment 3

The method of Embodiment 1 or Embodiment 2, wherein

$\frac{{weight}\mspace{14mu} {of}\mspace{14mu} {{bis}({phthalimide})}}{\begin{matrix}{{{weight}\mspace{14mu} {of}\mspace{14mu} {{bis}({phthalimide})}}\; +} \\{{weight}\mspace{14mu} {of}\mspace{14mu} {diphenyl}\mspace{14mu} {sulphone}\mspace{14mu} {or}\mspace{14mu} {sulfolane}}\end{matrix}}(100)$

is 1 to 30%, specifically 15 to 25%, preferably 18 to 22%.

Embodiment 4

The method of any one or more of Embodiments 1 to 3, further comprisingdetermining the stoichiometric molar ratio of the substituted phthalicanhydride to the organic diamine during the imidization of thesubstituted phthalic anhydride and the organic diamine; and optionallyadjusting the stoichiometric molar ratio by adding additionalsubstituted phthalic anhydride or organic diamine.

Embodiment 5

The method of any one or more of Embodiments 1 to 4, further comprisingheating the diphenyl sulfone to a temperature of greater than 130° C.,and combining the substituted phthalic anhydride and the organic diaminewith the heated diphenyl sulfone.

Embodiment 6

The method of any one or more of Embodiments 1 to 5, further comprisingadding a monofunctional reactant to the substituted phthalic anhydride,the organic diamine, the diphenyl sulfone, sulfolane, or a combinationcomprising at least one of the foregoing.

Embodiment 7

The method of any one or more of Embodiments 1 to 6, wherein thecontacting is conducted at a temperature of 130° C. to 250° C.

Embodiment 8

The method of any one or more of Embodiments 1 to 7, wherein thecontacting is conducted in the absence of an imidization catalyst.

Embodiment 9

The method of any one or more of Embodiments 1 to 8, wherein thepolymerization is conducted in the absence of a polymerization catalyst.

Embodiment 10

The method of any one or more of Embodiments 1 to 8, wherein thepolymerization is conducted in the presence of a polymerizationcatalyst.

Embodiment 11

The method of any one or more of Embodiments 1 to 10, wherein X ischloro, fluoro, bromo, or nitro, and R is —(C₆H₁₀)_(z)— wherein z is aninteger from 1 to 4, or a divalent group of formulae (3) or acombination comprising at least one of the foregoing, wherein Q¹ is asingle bond, —O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y isan integer from 1 to 5, or a combination comprising at least one of theforegoing.

Embodiment 12

The method of any one or more of Embodiments 1 to 11, wherein X ischloro and R is m-phenylene, p-phenylene, an arylene ether, adiarylsulfone, a group of the formula (3a) wherein Q¹- is a single bond,—O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y) wherein y is an integer from1 to 5, or a combination comprising at least one of the foregoing,preferably wherein R is m-phenylene, p-phenylene, para, para-diphenylether, 4,4-diphenylsulfone, or a combination comprising at least one ofthe foregoing.

Embodiment 13

The method of any one or more of Embodiments 1 to 12, wherein thedihydroxy aromatic compound comprises bisphenol A, hydroquinone,biphenol, resorcinol, or a combination comprising at least one of theforegoing.

Embodiment 14

The method of any one or more of Embodiments 1 to 13, wherein thedihydroxy aromatic compound is in a powder form or in a slurry form.

Embodiment 15

The method of any one or more of Embodiments 1 to 14, wherein thedihydroxy aromatic compound is dispersed in a solvent comprisingortho-dichlorobenzene, xylenes, toluene, diphenyl sulfone, sulfolane, ora combination comprising at least one of the foregoing.

Embodiment 16

The method of any one or more of Embodiments 1 to 15, wherein thedihydroxy aromatic compound is dispersed in ortho-dichlorobenzene.

Embodiment 17

The method of any one or more of Embodiments 1 to 16, wherein thebis(phthalimide) composition and the polyetherimide composition aremanufactured in the same vessel.

Embodiment 18

A method for the manufacture of a polyetherimide composition, the methodcomprising contacting a substituted phthalic anhydride and an organicdiamine in the presence of diphenyl sulfone, sulfolane, or a combinationcomprising at least one of the foregoing solvents at a temperature of130° C. to 250° C., wherein the substituted phthalic anhydride has aformula (7), and the organic diamine has a formula H₂N—R—NH₂ to providea bis(phthalimide) composition comprising diphenyl sulfone, sulfolane,or a combination comprising at least one of the foregoing solvents and abis(phthalimide) of the formula (9) and polymerizing thebis(phthalimide) and a sodium salt of a potassium salt of bisphenol A inthe presence of diphenyl sulfone, sulfolane, or a combination comprisingat least one of the foregoing solvents to form a polyetherimide of theformula (1) wherein in the foregoing formulae X is chloro; R ism-phenylene, p-phenylene, p,p-diphenylether, or 4,4′-diphenylsulfone; Zis of formula (4b); and n is an integer greater than 1.

Embodiment 19

A polyetherimide composition manufactured by a method of any one ofEmbodiments 1 to 18.

Embodiment 20

A polyetherimide composition wherein the polyetherimide has a structureof the formula (1) wherein R is an aromatic hydrocarbon group having 6to 27 carbon atoms, a halogenated derivative thereof, a straight orbranched chain alkylene group having 2 to 10 carbon atoms, a halogenatedderivative thereof, a cycloalkylene group having 3 to 20 carbon atoms, ahalogenated derivative thereof, —(C₆H₁₀)_(z)— wherein z is an integerfrom 1 to 4, an aromatic hydrocarbyl moiety having from 1 to 6 aromaticgroups, and a divalent group of the formula (2) wherein Q¹ is —O—, —S—,—C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y is an integer from 1 to 5,or a combination comprising at least one of the foregoing; and Z is anaromatic C₆₋₂₄ monocyclic or polycyclic moiety optionally substitutedwith 1 to 6 C₁₋₈ alkyl groups, 1 to 8 halogen atoms, or a combinationcomprising at least one of the foregoing; and n is an integer greaterthan 1; preferably wherein R is m-phenylene, p-phenylene,p,p-diphenylether, or 4,4′-diphenylsulfone; Z is formula (4b); and n isan integer from 10 to 50; and wherein the composition comprises one ormore of greater than 0.1 parts per million of diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoing, orgreater than 1 part per million of sodium or potassium, or a yellownessindex of less than 300.

The singular forms “a,” “an,” and “the” include plural referents unlessthe context clearly dictates otherwise. “Or” means “and/or.” Theendpoints of all ranges directed to the same component or property areinclusive and independently combinable. Unless defined otherwise,technical and scientific terms used herein have the same meaning as iscommonly understood by one of skill in the art to which this inventionbelongs. As used herein, a “combination” is inclusive of blends,mixtures, alloys, reaction products, and the like.

Compounds are described using standard nomenclature. For example, anyposition not substituted by any indicated group is understood to haveits valency filled by a bond as indicated, or a hydrogen atom. A dash(“-”) that is not between two letters or symbols is used to indicate apoint of attachment for a substituent. For example, —CHO is attachedthrough carbon of the carbonyl group.

All references cited herein are incorporated by reference in theirentirety.

While typical embodiments have been set forth for the purpose ofillustration, the foregoing descriptions should not be deemed to be alimitation on the scope herein. Accordingly, various modifications,adaptations, and alternatives can occur to one skilled in the artwithout departing from the spirit and scope herein.

What is claimed is:
 1. A polyetherimide composition wherein thepolyetherimide has a structure of the formula

wherein R is an aromatic hydrocarbon group having 6 to 27 carbon atoms,a halogenated derivative thereof, a straight or branched chain alkylenegroup having 2 to 10 carbon atoms, a halogenated derivative thereof, acycloalkylene group having 3 to 20 carbon atoms, a halogenatedderivative thereof, —(C₆H₁₀)_(z)— wherein z is an integer from 1 to 4,an aromatic hydrocarbyl moiety having from 1 to 6 aromatic groups, and adivalent group of the formula

wherein Q¹ is —O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y isan integer from 1 to 5, or a combination comprising at least one of theforegoing; and Z is an aromatic C₆₋₂₄ monocyclic or polycyclic moietyoptionally substituted with 1 to 6 C₁₋₈ alkyl groups, 1 to 8 halogenatoms, or a combination comprising at least one of the foregoing; and nis an integer greater than 1; and wherein the composition comprisesgreater than 0.1 parts per million of diphenyl sulfone, sulfolane, or acombination comprising at least one of the foregoing solvents.
 2. Thepolyetherimide composition of claim 1, comprising greater than 1 partper million of sodium or potassium, each based on the total weight ofthe composition.
 3. The polyetherimide composition of claim 1, having ayellowness index of less than
 300. 4. The polyetherimide composition ofclaim 1, wherein the polyetherimide composition is free of animidization catalyst.
 5. The polyetherimide composition of claim 1,wherein the polyetherimide composition is free of a polymerizationcatalyst.
 6. The polyetherimide composition of claim 1, wherein X ischloro, fluoro, bromo, or nitro, and R is a divalent radical of theformula —(C₆H₁₀)_(z)— wherein z is an integer from 1 to 4,

or a combination comprising at least one of the foregoing, wherein Q¹ isa single bond, —O—, —S—, —C(O)—, —SO₂—, —SO—, —C_(y)H_(2y)— wherein y isan integer from 1 to 5, or a combination comprising at least one of theforegoing.
 7. The polyetherimide composition of claim 1, wherein X ischloro and R is m-phenylene, p-phenylene, an arylene ether, adiarylsulfone, a group of the formula

wherein Q¹- is a single bond, —O—, —S—, —C(O)—, —SO₂—, —SO—,—C_(y)H_(2y) wherein y is an integer from 1 to 5, or a combinationcomprising at least one of the foregoing.
 8. The polyetherimidecomposition of claim 1, wherein the polyetherimide is derived from apolydihydroxy aromatic compound comprising bisphenol A, hydroquinone,biphenol, resorcinol, or a combination comprising at least one of theforegoing.
 9. The polyetherimide composition of claim 1, comprisinggreater than 1 to 1,000 parts per million of diphenyl sulfone,sulfolane, or a combination comprising at least one of the foregoingsolvents.
 10. The polyetherimide composition of claim 1, comprisinggreater than 1 to 1,000 parts per million of diphenyl sulfone.
 11. Thepolyetherimide composition of claim 1, comprising greater than 1 to1,000 parts per million of sulfolane.
 12. The polyetherimide compositionof claim 1, comprising 10 to 10,000 parts per million of sodium orpotassium, each based on the total weight of the composition.
 13. Thepolyetherimide composition of claim 1, comprising 10 to 1,000 parts permillion of sodium or potassium, each based on the total weight of thecomposition.
 14. The polyetherimide composition of claim 1, wherein thepolyetherimide composition comprises a solvent, and the composition isin the form of a varnish.
 15. The polyetherimide composition of claim 1,further comprising a heat stabilizer, a mold release agent, or acombination comprising at least one of the foregoing.
 16. Thepolyetherimide composition of claim 1, further comprising at least oneadditional polymer, the additional polymer comprising polyphenylenesulfone, polysulfone, polyphenylene ether, perfluoroalkoxy alkane,co-polymer of tetrafluoroethylene and perfluorinated vinyl ether,fluorinated ethylene propylene polymers, poly(phenylene sulfide,polytetrafluoroethylene, polyamide, polybenzimidizole,poly(amide-imide), poly(ether sulfone), poly(aryl sulfone),polyphenylene, polybenzoxazoles, polybenzthiazoles, or a combinationcomprising at least one of the foregoing.
 17. The polyetherimidecomposition of claim 16, wherein the additional polymer is present in anamount of 0.1 to 15 wt. % based on the total weight of thepolyetherimide composition.